Heat radiator

ABSTRACT

A heat radiator includes a water tank containing cooling liquid. A first radiating member has a top plate secured at top edges of the water tank. Multiple first fins are formed beneath the top plate and immersed in the cooling liquid. A heat insulating pad is adhered on the top plate. At least one semiconductor refrigerating component is mounted on the top plate and has a hot surface abutting the top plate and a cold surface exposed from the heat insulating pad. A second radiating member is positioned on the first radiating member and has a bottom plate with an area over the semiconductor refrigerating component. Multiple second fins are formed on the bottom plate. A fan is mounted on the second fins of the second radiating member.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat radiator, and more particularlyto a cooling means for lowering a temperature of a device or elementwhich generates significant amounts of heat in operation.

2. Description of Related Art

For lowering a temperature of a device or element such as a CPU, orelectronic chips which generate lots of heat in operation, a heatradiator is generally mounted on the device or element.

A conventional heat radiator includes multiple fins formed on a body,and a fan installed on the fins. However, the fan in operation also willgenerate heat and gradually become hot, so the radiating effect of theconventional heat radiator is low.

A novel heat radiator assembled with a semiconductor refrigeratingcomponent utilizing the Peltire Effect is invented. The semiconductorrefrigerating component includes a hot surface and a cold surfaceopposite to the hot surface with a temperature difference between thetwo surfaces. In operation, the cold surface will have a very lowtemperature to provide an improved radiating effect. However, thetemperature of the hot surface will rise, so the cold surface cannotretain the predetermined low temperature and the heat radiator stilldoes not have a satisfying radiating effect.

Therefore, the invention provides an improved heat radiator to mitigateor obviate the aforementioned problems.

SUMMARY OF THE INVENTION

The main objective of the present invention is to provide a heatradiator which has an improved radiating effect.

Other objectives, advantages and novel features of the invention willbecome more apparent from the following detailed description when takenin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THF DRAWINGS

FIG. 1 is an exploded perspective view of a heat radiator in accordancewith the invention;

FIG. 2 is a cross sectional view of the heat radiator without coolingliquid; and

FIG. 3 is a cross sectional view of the heat radiator with coolingliquid contained in a tank.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

With reference to FIGS. 1-2, a heat radiator in accordance with theinvention is composed of a water tank (10), a first radiating member(20), a second radiating member (30), a fan (40), and a cover (50).

The water tank (10) has a hollow body (not numbered) for containing acooling liquid such as water (11), as shown in FIG. 3. Multiple barbs(12) are formed at upper edges of the water tank (10). A rim (notnumbered) is formed in the water tank (10) and beneath the upper edges.

The first radiating member (20) is made of aluminum or other metals witha high heat conductivity. A top plate (21) is formed at a top of thefirst radiating member (20) and supported by the rim of the water tank(10) so as to position the first radiating member (20) in the water tank(10). The top plate (21) and the rim can be sealed together to preventthe water (11) from leaking out from the water tank (10). Multiple firstfins (22) are formed beneath the top plate (21) and immersed in thewater (11). A heat insulating pad (24) is spread over the plate (21). Atleast one semiconductor refrigerating component (23) is mounted on theplate (21) and in the heat insulating pad (24). The refrigeratingcomponent (23) has a hot surface (not numbered) abutting the plate (21)and a cold surface (not numbered) exposed from the heat insulating pad(24).

A shield (25) is formed beneath the plate (21) and outside the firstfins (22) with a length larger than the first fins (22). Thus, in anindividually disposed status, the first member (20) can be supported bythe shield (25), and the first fins (22) with a low strength areprotected by the shield (25).

The second radiating member (30) is positioned on the first radiatingmember (20) and also made of aluminum or other metals with a high heatconductivity. A bottom plate (31) is formed at a bottom of the secondradiating member (30) with an area over the semiconductor refrigeratingcomponent (23) and abuts the cold surface of the semiconductorrefrigerating component (23). Multiple second fins (32) are formed onthe bottom plate (31).

The fan (40) is secured on the second fins (32) of the second radiatingmember (30) by screws (not numbered). As usual, the fan (40) is composedof a frame (41), a stator (not numbered) and a rotor (42).

The cover (50) is detachably mounted on the water tank (10), and hasmultiple louvers (51) defined at top and side surfaces thereof. A handle(52) is formed on the cover (50) to facilitate a user to carry the heatradiator. Multiple hooks (53) are formed at lower edges of the cover(50), and the barbs (12) are respectively attached to the hooks (53) tofasten the cover (50) on the water tank (10).

With reference to FIG. 3, in use, the electrified semiconductorrefrigerating components (23) will become cold at the cold surface, andthe temperature of the second radiating member (30) is accordinglylowered. Air drawn in by the fan (40) through the louver (51) at the topsurface of the cover (50) flows through the second radiating member (30)and become cold, and then the cold air is blown out from the louvers(51) at the side surface of the cover (50) for cooling a hot object. Theheat generated at the hot surface of the semiconductor refrigeratingcomponent (23) is insulated by the heat insulating pad (24) and onlytransferred to the first fins (22) of the first radiating member (20).Cooled by the water (11) in the water tank (10), the hot surface (232)can retain a low temperature, so the cold surface (231) has an improvedradiating effect. Furthermore, the water tank (10) can be provided witha temperature controller (not shown) for stopping the operation of thesemiconductor refrigerating component (23) in a situation of thetemperature of the water (11) reaching a predetermined value.

Therefore, because the hot surface is cooled by water and the coldsurface can retain a low temperature, the heat radiator according to thepresent invention has a good radiating effect.

It is to be understood, however, that even though numerouscharacteristics and advantages of the present invention have been setforth in the foregoing description, together with details of thestructure and function of the invention, the disclosure is illustrativeonly, and changes may be made in detail, especially in matters of shape,size, and arrangement of parts within the principles of the invention tothe full extent indicated by the broad general meaning of the terms inwhich the appended claims are expressed.

1. A heat radiator comprising: a water tank having a hollow body, andcooling liquid contained in the hollow body; a first radiating memberhaving a top plate secured at top edges of the water tank, multiplefirst fins formed beneath the top plate and immersed in the coolingliquid, a heat insulating pad adhered on the top plate, and at least onesemiconductor refrigerating component mounted on the top plate andhaving a hot surface abutting the top plate and a cold surface exposedfrom the heat insulating pad; a second radiating member positioned onthe first radiating member and having a bottom plate with an area overthe at least one semiconductor refrigerating component, and multiplesecond fins formed on the bottom plate; and a fan mounted on the secondfins of the second radiating member.
 2. The heat radiator as claimed inclaim 1 further comprising a cover detachably mounted on the water tankto envelop the second radiating member and the fan, and louvers definedat top and side surfaces of the cover.
 3. The heat radiator as claimedin claim 2, wherein the cover has a handle formed thereon.
 4. The heatradiator as claimed in claim 1, wherein the first radiating memberfurther has a shield formed beneath the plate and outside the first finswith a length larger than the first fins.
 5. The heat radiator asclaimed in claim 2, wherein the water tank has multiple barbs formed atthe top edges of the hollow body, and the cover has multiple hooksformed at bottom edges of the cover and respectively attached to thebarbs.